HDI PCB for communication module

Base Material: FR-4/ High TG FR-4/ Halogen Free material/ Rogers/ Arlon/ Taconic/ Teflon
Layers: 1-40
Finised inner/outer copper thickness: 1-15OZ
Finished board thickness: 0.2-7.0mm
Min hole size: Mechanical hole: 0.15mm / Laser hole: 0.1mm
Controlled Impedance: +/-5%
Plugging vias capability: 0.2-0.8mm
Outline profile: Rout/ V-cut/ Bridge/ Stamp hole
Surface treatment: HASL, HASL lead free, Immersion Gold, Immersion Tin, Immersion Silver, Hard gold, Flash gold, OSP…